As the world is entering a new era of the 4th industrial revolution, the semiconductor market is likely to show a high rate of growth with a focus on vehicles, the Internet of things (IoT), big data, and artificial intelligence (AI). In particular, approximately 200 ~ 400 parts on average are required for each car, as a variety of electric devices are used for safety and comfort. Semiconductors for vehicles are mainly used for core parts such as vehicle sensors, engines, control devices, and driving units. This means that they require a higher level of reliability and durability compared to semiconductors for household use e.g. computers or Smartphone. KCC is the only company in Korea to be developing semiconductor materials for the vehicles market by composing a line-up in the materials part excluding semiconductor wipers and chips in the vehicle semiconductor market, which itself requires such high reliability and safety.
KCC supplies DCB (Direct Copper Bonding), which is a ceramic board for vehicle power management semiconductors. DCB is a product that enables semiconductor devices to run efficiently for a long time at high voltages and in a high current environment where metals or plastic boards cannot be applied. KCC has entered the 2018 market and demonstrated continuous growth. KCC is expanding the business area in the advanced materials area, which is the core generic technology in the age of the 4th industrial revolution, by supplying various semiconductor devices such as EMC (Epoxy Molding Compound), DAF (Die Attach Film), and LEB (Liquid Epoxy Bond), besides DCB. EMC (Epoxy Molding Compound) is a semiconductor protection element that protects major materials (e.g. silicon chip, wire, lead frame) from external heat, moisture, and shock.
EMC is used in most products that use the semiconductor, such as general home appliances (e.g. mobile phone, computer, TV), industrial equipment, and vehicle. DAF (Die Attach Film) is a film type adhesive that binds the semiconductor chip on the substrate. DAF is frequently used for memory semiconductors like USB and SD cards, and is widely used as an indispensable material for highly integrated semiconductor devices thanks to its process simplification and multi-layer formation of the semiconductor chip.
LEB (Liquid Epoxy Bond), which is a liquid phase adhesive based on epoxy resin, binds the semiconductor chip on the substrate so that electric signals can be transferred. LEB is applied to the D-RAM memory and NAND Flash inside computers and mobile devices. It offers intensive adhesive strength, thermal resistance, and water-resisting qualities. KCC plans to expand the market by developing state-of-the-art semiconductor device technology in the car market, which is the key to the 4th industrial revolution, and endeavor more to improve global competitiveness based on its organic/inorganic materials convergence technology.